Wafers Packing Machine
Wafers Packing Machine

Wafers Packing Machine

Price 1650000.0 INR/ Pack

MOQ : 1 Pack

Wafers Packing Machine Specification

  • Usage
  • Industrial food packaging
  • Application
  • Wafer, Namkeen and Confectionery Packing
  • Noise Level
  • 30 db
  • Power Supply
  • Single Phase
  • Features
  • Easy to operate, Quick changeover, Hygienic design
  • Filling Range
  • Adjustable, typically 10 gm - 1 kg
  • Type
  • Other
  • Material
  • Stainless Steel
  • Feature
  • Highly Efficient, Heavy Duty Machine
  • Auxiliary Packaging Machine Type
  • Other
  • Capacity
  • 60-65 packs per minute Pcs/min
  • Computerized
  • Yes
  • Automatic Grade
  • Automatic
  • Control System
  • Human Machine Interface
  • Drive Type
  • Pneumatic
  • Power
  • 5-6 Watt (w)
  • Voltage
  • 220V/50Hz Volt (v)
  • Weight (kg)
  • Approx. 750 kg Kilograms (kg)
  • Dimension (L*W*H)
  • 4200 mm x 900 mm x 1500 mm Centimeter (cm)
  • Color
  • Other
  • Warranty
  • 1 YEAR
  • Sealing Type
  • Heat Sealing
  • Film Roll Diameter
  • Max. 320 mm
  • Film Thickness
  • 30-80 microns
  • Packing Material
  • Laminated Film, BOPP, Polyester & Poly, Metalized Film
  • Maintenance Requirement
  • Low and Easy
  • Operating Temperature
  • 5-40C
  • Cutting System
  • Photo Mark Sensor for Accurate Cutting
  • Packaging Style
  • Pillow Pack/Wrapped Pack
  • Date Coding Device
  • Optional attachment available
  • Packing Speed Adjustability
  • Variable Frequency Drive
  • Feeding System
  • Automatic Conveyor with Adjustable Guides
  • Operator Interface
  • Touch Screen HMI
  • Humidity Tolerance
  • Up to 85% RH, non-condensing
  • Compliance Standards
  • CE Certified, GMP standards
  • Safety Features
  • Emergency stop, Overload protection
  • Pre-set Memory
  • Programmable for multiple product sizes
 

Wafers Packing Machine Trade Information

  • Minimum Order Quantity
  • 1 Pack
  • Payment Terms
  • Cash in Advance (CID)
  • Supply Ability
  • 5000 Packs Per Month
  • Delivery Time
  • 9 Days
  • Main Domestic Market
  • All India
 

About Wafers Packing Machine



Experience elite performance with our Wafers Packing Machine - a champion among industrial food packaging solutions. This magnificent unit supports a sizzling packing speed of 60-65 packs per minute, tailored for wafers, biscuits, and confectioneries. Engineered from valuable stainless steel, it showcases a robust structure and operates with high efficiency and minimal maintenance. Featuring adjustable feeding, a photo mark sensor for precise cutting, and a touch screen HMI, this automatic, computerized machine ensures seamless, hygienic packaging. Fully compliant with CE and GMP standards, its quick changeover, low noise level, and programmable memory make it the smart, reliable choice for the discerning exporter or manufacturer.

Application Versatility & Special Features

Our Wafers Packing Machine excels across the confectionery, biscuit, and wafer sectors, with a wide filling range of 10 gm to 200 gm. Notable features include an automatic conveyor, programmable memory, touch screen HMI, and advanced safety protocols. The machine's robust, hygienic design and efficient photo mark sensor allow for seamless operation and quick product changeover. Its adaptability extends to packaging other snacks and food products, underscoring its value in diverse industrial environments.


Swift Shipment and Delivery Details

Expect a streamlined arrival process when ordering from us. With robust supply ability and efficient packing, your Wafers Packing Machine leaves our FOB port promptly after order confirmation. We prioritize quick shipment to minimize lead times, ensuring that your freight reaches you without unnecessary delays. Our export capabilities guarantee careful handling during transport, allowing your valuable equipment to arrive in pristine condition, ready for commissioning and immediate operation.


FAQ's of Wafers Packing Machine:


Q: How does the Wafers Packing Machine ensure accurate product packaging?

A: The Wafers Packing Machine employs a photo mark sensor cutting system for precise film cutting, while adjustable guides and an automatic conveyor maintain product alignment, delivering consistently accurate pillow packs or wrapped packs.

Q: What types of packaging materials can be used with this machine?

A: This machine accommodates a variety of films including laminated film, BOPP, polyester and poly, as well as metalized film with thicknesses between 30-80 microns, providing flexibility for different packaging needs.

Q: What is the process for quick product changeover?

A: With pre-set programmable memory and an easy-to-use touch screen HMI, switching between different product sizes or settings is rapid and simple, minimizing downtime between production runs.

Q: When is maintenance required and how easy is it?

A: The machine is engineered for low and easy maintenance. Routine inspections and cleaning are generally sufficient, with overload protection and emergency stop features ensuring operational safety.

Q: Where can the Wafers Packing Machine be used?

A: Due to its robust design and compliance with CE and GMP standards, this machine is ideal for industrial food packaging facilities, including exporters, manufacturers, and suppliers within the confectionery industry.

Q: What benefits does the automatic feeding system offer?

A: The automatic conveyor with adjustable guides enables high speed, consistent feeding, reducing labor effort and increasing operational efficiency. This boosts overall production output while ensuring gentle handling of delicate wafer products.

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Minimum Order Quantity : 1 Unit

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Computerized : Yes

Control System : Other, PLC Based Touch Screen Panel

Power : 2.5 kW

Sealing Type : Other, Center Seal / Three Side / Four Side



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